How to Repair iPhone Air Error 4010

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How to Repair iPhone Air Error 4010
Device	iPhone 17 Air
Affects part(s)	Main Logic Board
Needs equipment	Soldering Iron, Hot Air Station, Desoldering Wick, Reballing Stencil, Soldering Paste, Tweezer
Difficulty	◉◉◉◉ Specialist
Type	Soldering

Problem description

When attempting to restore an iPhone Air, the process begins normally but fails with Error 4010 while the progress bar is visible.

This fault is specific to board structure — the iPhone Air uses a two-layer stacked logic board design, and the upper small interposer board must be properly soldered and communicating for restore to complete.

If the upper small board is missing, misaligned, or has poor solder joints, iTunes/Finder fails to communicate through the interposer, resulting in a restore failure (Error 4010).

iPhone Air - Error 4010

iPhone Air - Interposer Layer

Symptoms

• iTunes/Finder restore stops midway and displays Error 4010.
• Device enters recovery mode but cannot complete restore.
• Progress bar appears on the device before failure.
• Logic board previously separated or worked on (reball/reflow attempt visible).
• No visible liquid or burn marks.
• Top small interposer board missing or partially soldered.

Solution

Ensure the upper small board is properly installed and soldered to the main board using clean interposer pads.

Error 4010 occurs when communication between the interposer layer is missing.

Diagnostic Steps

1. Visual Inspection
   • Confirm whether the upper small board (highlighted in red in image) is installed.
   • Check for partial seating, lifted pads, or missing solder balls on the interposer array.
   • Inspect for previous rework signs — flux residue, uneven board gap, or warped interposer.
2. Restore Behavior Observation
   • If device is recognized and begins restore but fails with Error 4010, communication starts but fails mid-process — strong indication of interconnect fault.

Repair Steps

1. Preparation
   • Clean both upper and lower board pads.
2. Reballing the Small Board
   • Reball lower layer using 148/158 solder paste.
   • Inspect under microscope for uniform ball shape and no bridges.
3. Reflow & Installation
   • Align the small board precisely with the lower board under microscope.
   • Heat until solder joints settle and board self-aligns.
   • Avoid excessive pressure to prevent pad sinking.
4. Testing
   • Allow the board to cool fully.
   • Attempt restore again — device should now restore fully with no Error 4010.
5. Final Verification
   • Complete setup process and check IMEI, Wi-Fi, and serial data for full functionality.