Avatar HD Goggles

Avatar HD Goggles
Manufacturer	Walksnail
Code name
Release date
Device type	Drone

Walksnail Avatar HD fpv goggles are also sold as Fat Shark Dominator HD FSV1125

https://walksnail.com/

https://www.fatshark.com/

About The System:[edit | edit source]

The Avatar HD Goggles are a new digital FPV goggle made by Walksnail part of CaddX FPV.

These Goggles have been made in partnership with Fat Shark and are sold under both the Fat Shark and Walksnail brand.

They are both compatible with the Walksnail Avatar HD VTX and offer same/similar functionally.

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Device pictures

PCB pictures

Avatar FPV Goggles PCB

Reference measurements (also schematics if available)

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More Information/External Sources

Walksnail Avatar HD fpv goggles are also sold as Fat Shark Dominator HD FSV1125

https://walksnail.com/ - https://www.fatshark.com/

About The System:

The Avatar HD Goggles are a new digital FPV goggle made by Walksnail part of CaddX FPV.

These Goggles have been made in partnership with Fat Shark and are sold under both the Fat Shark and Walksnail brand.

They are both compatible with the Walksnail Avatar HD VTX and offer same/similar functionally.

Important SOC Images Notes:

The main SOC is labelled as a Xilinx Virtex 5 XC5VLX50T - FFG1136FGU2033 - AC4284883A1 2C.

Based on code samples and SOC package it is strongly believed this is not this FPGA. Its believed to be a Artosyn RF Chipset such as the AR9201/AR8211.

Specification

AR9201

Application Processor Core

 1.5GHz ARM Cortex-A7 quad-core, each core with 32KB I-cache, 32KB D-cache

 512KB L2 cache

 Neon acceleration and double precision FPU

 Embedded Trace data interface (16KB ETB) for ARM-DS5 debugger

 DVFS control: Dynamic voltage and frequency scaling to reduce power consumption

MCU core

 500MHz CPU, 16Kbyte I-cache, 16KB D-cache

 128KB ITCM and 64KB DTCM

 Double precision FPU

CEVA DSP core

 4 x high performance CEVA XM4 Cores at 1000MHz

 2M-Byte shared on-chip SRAM

Video Codec Format

 H.264 BP/MP/HP encoding and decoding

 H.265 MAIN/MAIN10 @L5.0 High-tier encoding and decoding

 MJPEG/JPEG Extended Sequential encoding and decoding

Video Codec Performance

 Software configurable video codec, either as encoder or as decoder

 Real-time multi-stream H.264/H.265 encoding or decoding:

 H.264: [/cdn-cgi/l/email-protection [email protected]]

 [/cdn-cgi/l/email-protection [email protected]][/cdn-cgi/l/email-protection [email protected]]

 MJPEG/JPEG encoding/decoding at [/cdn-cgi/l/email-protection [email protected]]

 MJPEG/JPEG encoding and decoding

Baseband

 2T4R with 2.5MHz/5MHz/10MHz/20MHz/40MHz bandwidth

 BPSK/QPSK/16QAM/64QAM/256QAM modulation

 LDPC encoder with 1/2, 2/3, 3/4 code rate

 Max down link rate at 100Mbps

 2.4G/5.8G uplink/downlink communication

 One AP support max to four nodes

Analog

 One 8-1 10bit SAR ADC

 Two 10bit SAR ADCs

 Four 12bit DACs

 Eight 12bit ADCs

Peripherals

 9 UARTs

 2 Watch dog timers

 20 timers,10 of which have PWM output

 4 CAN bus interface

 5 I2C interfaces, can be configured as either master or slave by software

 4 SPI masters(2x1-1, 2x1-5 ), 2 SPI slave

 4 I2S 4bit interfaces

 147 GPIO, shared with other functions.

 2 AXI DMA controller

 One AHB DMA controller

 USB 3.0 DRD controller and PHY.

 USB 3.0 /Type-C / DisplayPort combo interface

 10 /100/1000M Ethernet RGMII interface

 2-lane PCIe 2.0, can be configured as EP or RC mode

External Memory Interfaces

DDR4/DDR3/LPDDR3 interface

 16/32/64-bit DDR4 interface up to DDR4 2400

 16/32/64-bit DDR3L interface up to DDR3L 2133

 32/64-bit LPDDR3 interface up to LPDDR3 2133

SPI NOR flash interface

 1-/2-/4-wire mode

 3-byte or 4-byte address mode

 Maximum capacity of 256 MB NOR flash or MCP SPI NOR+NAND flash

eMMC 5.1 interface with 64GB max capacity

Secure Boot from internal ROM with eMMC flash or SPI NOR flash.

Physical Specification

Power consumption

 3W typical power consumption in the 4Kx2K scenario

 Multiple power domains for power saving

[11:19]

Operating voltages

 0.9V core voltage

 1.8VI/O voltage

 1.2V/1.2V/1.5V for DDR4/LPDDR3/DDR3(L)

 3.3VI/O voltage

Package

 FCBGA

 Body size of 19mm x19mm

 Ball pitch of 0.65mm