More actions
(made a guide without pictures) |
No edit summary |
||
| (5 intermediate revisions by the same user not shown) | |||
| Line 1: | Line 1: | ||
{{Repair Guide | {{Repair Guide | ||
|Device= | |Device=Galaxy A12 | ||
|Affects parts= | |Affects parts=Logic Board | ||
|Needs equipment= | |Needs equipment=Soldering Iron, Hot Air Station, Microscope | ||
|Type= | |Type=Soldering, BGA | ||
|Difficulty= | |Difficulty=4. Specialist | ||
}} | }} | ||
{{stub}} | |||
== Problem description == | == Problem description == | ||
<!-- | <!-- | ||
| Line 38: | Line 39: | ||
* Visible '''impact damage''' or '''dents''' on the shield near the affected area | * Visible '''impact damage''' or '''dents''' on the shield near the affected area | ||
[[File:Initial problem a127(non mtk).png|left|thumb|214x214px|Damage near shield]] | |||
<br> | |||
<br> | |||
<br> | |||
<br> | |||
<br> | |||
<br> | |||
<br><br><br> | |||
* '''Ground pad''' under the shield is either damaged or '''torn off''' with the shield | * '''Ground pad''' under the shield is either damaged or '''torn off''' with the shield | ||
| Line 43: | Line 56: | ||
* Carefully '''scrape off the first (ground) layer''' where shown. | * Carefully '''scrape off the first (ground) layer''' where shown. | ||
** If you observe '''bubbling''', '''lifted fibers''', or signs of '''delamination''', proceed with the repair steps | ** If you observe '''bubbling''', '''lifted fibers''', or signs of '''delamination''', proceed with the repair steps | ||
[[File:2025 06 22 13 52 IMG 8465.PNG|left|thumb|208x208px|Delamination of 2nd layer]] | |||
<br> | |||
<br> | |||
<br> | |||
<br> | |||
<br> | |||
<br> | |||
<br> | |||
<br> | |||
=== Repair Steps === | === Repair Steps === | ||
* Remove the | * Remove the first (ground) layer in the affected area | ||
* | * Access the second layer and carefully remove the damaged and show the traces | ||
* Pretin the traces | [[File:2025 05 19 15 57 IMG 7935.JPG|left|thumb|177x177px|Traces exposed of second layer]] | ||
* Clean | <br> | ||
<br> | |||
<br> | |||
<br> | |||
<br> | |||
<br> | |||
<br> | |||
* Pretin the traces to make jumpers | |||
* Mentioned the traces that go to power ic from cpu for sound functions | |||
[[File:PMIC TO CPU TRACES A127.png|left|thumb|173x173px|traces to pmic]] | |||
<br> | |||
<br> | |||
<br> | |||
<br> | |||
<br> | |||
<br> | |||
<br> | |||
<br> | |||
<br> | |||
<br> | |||
* Use 0.007mm silver jumper wire to reconstruct the connections | |||
* Clean the area thoroughly | |||
* Apply UV-curable solder mask to insulate the repair | |||
Latest revision as of 12:38, 22 June 2025
| Galaxy A127(exynos) Earpiece and Mic Not Working | |
|---|---|
| Device | Galaxy A12 |
| Affects part(s) | Logic Board |
| Needs equipment | Soldering Iron, Hot Air Station, Microscope |
| Difficulty | ◉◉◉◉ Specialist |
| Type | Soldering, BGA |
This article is a stub. You can help Repair Wiki grow by expanding it
Problem description
The main microphone and earspeaker are completely non-functional.
This issue typically arises after severe physical damage, such as heavy drops or bending near the shield area.
Note: You may have already attempted replacing components like the screen, dock, or earpiece, but the issue persists.
Symptoms
- Unable to hear or speak during phone calls
- Voice memos either cannot be recorded or are recorded without sound
- Earspeaker fails the earpiece test in the Samsung service menu
- Diode readings on the Main FPC Connector and earpiece output are within normal range
Solution
Diagnostic Steps
- Visible impact damage or dents on the shield near the affected area
.png)
- Ground pad under the shield is either damaged or torn off with the shield
- Carefully scrape off the first (ground) layer where shown.
- If you observe bubbling, lifted fibers, or signs of delamination, proceed with the repair steps
Repair Steps
- Remove the first (ground) layer in the affected area
- Access the second layer and carefully remove the damaged and show the traces
- Pretin the traces to make jumpers
- Mentioned the traces that go to power ic from cpu for sound functions
- Use 0.007mm silver jumper wire to reconstruct the connections
- Clean the area thoroughly
- Apply UV-curable solder mask to insulate the repair