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* Visible '''impact damage''' or '''dents''' on the shield near the affected area | * Visible '''impact damage''' or '''dents''' on the shield near the affected area | ||
[[File:Initial problem a127(non mtk).png|left|thumb|214x214px|Damage near shield]] | [[File:Initial problem a127(non mtk).png|left|thumb|214x214px|Damage near shield]] | ||
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** If you observe '''bubbling''', '''lifted fibers''', or signs of '''delamination''', proceed with the repair steps | ** If you observe '''bubbling''', '''lifted fibers''', or signs of '''delamination''', proceed with the repair steps | ||
[[File:2025 06 22 13 52 IMG 8465.PNG|left|thumb|208x208px|Delamination of 2nd layer]] | [[File:2025 06 22 13 52 IMG 8465.PNG|left|thumb|208x208px|Delamination of 2nd layer]] | ||
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* Access the second layer and carefully remove the damaged and show the traces | * Access the second layer and carefully remove the damaged and show the traces | ||
[[File:2025 05 19 15 57 IMG 7935.JPG|left|thumb|177x177px|Traces exposed of second layer]] | [[File:2025 05 19 15 57 IMG 7935.JPG|left|thumb|177x177px|Traces exposed of second layer]] | ||
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[[File:PMIC TO CPU TRACES A127.png|left|thumb|173x173px|traces to pmic]] | [[File:PMIC TO CPU TRACES A127.png|left|thumb|173x173px|traces to pmic]] | ||
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* Use 0.007mm silver jumper wire to reconstruct the connections | * Use 0.007mm silver jumper wire to reconstruct the connections | ||
* Clean the area thoroughly | * Clean the area thoroughly | ||
* Apply UV-curable solder mask to insulate the repair | * Apply UV-curable solder mask to insulate the repair | ||
Latest revision as of 12:38, 22 June 2025
| Galaxy A127(exynos) Earpiece and Mic Not Working | |
|---|---|
| Device | Galaxy A12 |
| Affects part(s) | Logic Board |
| Needs equipment | Soldering Iron, Hot Air Station, Microscope |
| Difficulty | ◉◉◉◉ Specialist |
| Type | Soldering, BGA |
This article is a stub. You can help Repair Wiki grow by expanding it
Problem description
The main microphone and earspeaker are completely non-functional.
This issue typically arises after severe physical damage, such as heavy drops or bending near the shield area.
Note: You may have already attempted replacing components like the screen, dock, or earpiece, but the issue persists.
Symptoms
- Unable to hear or speak during phone calls
- Voice memos either cannot be recorded or are recorded without sound
- Earspeaker fails the earpiece test in the Samsung service menu
- Diode readings on the Main FPC Connector and earpiece output are within normal range
Solution
Diagnostic Steps
- Visible impact damage or dents on the shield near the affected area
.png)
- Ground pad under the shield is either damaged or torn off with the shield
- Carefully scrape off the first (ground) layer where shown.
- If you observe bubbling, lifted fibers, or signs of delamination, proceed with the repair steps
Repair Steps
- Remove the first (ground) layer in the affected area
- Access the second layer and carefully remove the damaged and show the traces
- Pretin the traces to make jumpers
- Mentioned the traces that go to power ic from cpu for sound functions
- Use 0.007mm silver jumper wire to reconstruct the connections
- Clean the area thoroughly
- Apply UV-curable solder mask to insulate the repair